accuracy for the subsequent building of semiconductor devices and integrated circuits. This hands-on resource offers engineers detailed guidance in the entire substrate surface preparation process, from lapping and polishing...to specialized techniques and surface finishing. Supported with over 125 illustrations, this unique book provides a complete understanding of important maintenance methods and the full range of equipment available in the field. Practitioners gain the know-how and confidence they need to produce desired results when processing a sample of new material, rather than wasting time and money on a trial and error approach. Moreover, this authoritative book presents in-depth discussions on key applications, such as optics production and semiconductor de-lamination and deconstruction.

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