
Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging)
by Nell B. Dale- List Price: $249.99
- ISBN-10: 0792376765
- ISBN-13: 9780792376767
- Edition: 2003rd
- Type: Hardcover
- Publisher: Springer
About The Book
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called... Read more
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