thoroughly describes the complicated and new IC chip fabrication processes in detail—with minimum mathematics, physics, and chemistry. Advanced technologies are covered along with older ones to provide an understanding of the development processes from a historic point of view. The coverage in this book will help users 1)learn more about their job-related knowledge, 2)improve troubleshooting and problem-solving skills, and 3)raise their career development potentials. This coverage includes semiconductor basics; wafer manufacturing; thermal processes; photolithography; plasma basics; ion implantation; etch; CVD and dielectric thin film; metallization; CMP; process integration; and CMOS processes. For operators, technicians, engineers, and personnel of sales, marketing, administration and management who are working in the semiconductor industry and semiconductor related industries. s.

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