Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

by Sheng Liu
  • List Price: $159.95
  • ISBN-10: 0470827807
  • ISBN-13: 9780470827802
  • Edition: 1st
  • Type: Hardcover
  • Publisher: Wiley

About The Book

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are... Read more

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